Google's Tensor chips, specifically in Pixel smartphones, have been subject to criticism due to overheating issues, which have emerged as the leading cause for product returns. Leaked internal documents indicate that Google is aware of these thermal challenges and is working to address them in future iterations of the chip, particularly the upcoming Tensor G6, codenamed “Malibu.” The slides reveal that overheating presents not only a user satisfaction problem but also has significant implications for return rates.

The documents emphasize the urgency of tackling thermal performance, highlighting that current thermal comfort limits are too high and need adjusting. Furthermore, battery life is also a priority for Google, as better battery performance attracts users and fosters brand loyalty. Past models have struggled with overheating and battery issues, especially before the Tensor G3 found in the Pixel 8 series, which saw substantial improvements. Although developments for Tensor G3 were set before its release, it appears that Google is maintaining its focus on enhancing heat management and battery life in its future chip designs.

The leaked slides further detail Google's roadmap for the Tensor line, emphasizing improvements for both the Tensor G5, codenamed “Laguna,” and the G6. A critical strategy for achieving better thermal regulation and battery efficiency involves shifting to more advanced TSMC manufacturing processes, which have also benefited Apple products. Such an upgrade is anticipated to yield significant enhancements in the chips' operational efficiency.

Overall, the internal documentation underscores a proactive approach by Google in addressing the principal complaints associated with Pixel devices, setting the stage for improvements in the upcoming models.